Design and computing simulation, fabrication and characterization of a thin film Ti/Pt heater evaporated on a Silicon substrate and integrated with a microfluidic is presented. The heater was integrated with a microfluidic system obtained with classical photolithography process consisting in a polydimethylsiloxane (PDMS) stamp. Before realizing the heater the heat transfer of system with external environment was simulated for a following comparison with the real device. Models have been developed using COMSOL Multiphysics incorporated in a optimization routine to study and predict the behaviour of microheater made with metallic resistor over a Silicon surface with the goal to developing a tool that can be used to design different geometrical configurations with different materials. The simulation results, and as consequence the model, were found to be adequate to present the behaviour of microheater and the heat transfer with microfluidic system. The model can be used to compare different geometrical configurations and the thermal behaviour of different materials.
1 Jan 2012
Excerpt from the Proceedings of the 2012 COMSOL Conference in Milan