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Type: 
Journal
Description: 
Copper (Cu) film bonded with polymer substrates offers better dimensional stability than that of deposited Cu especially in humid environment. However, poor adhesion is an issue in both cases. In this paper, we demonstrate a two-step, low temperature direct bonding technique for liquid crystal polymer (LCP) and copper (Cu) using oxygen plasma. The bonded interface showed high peel strength. This strong adhesion is due to the interdiffusion of Cu and carbon atoms into LCP and Cu film respectively. These …
Publisher: 
North-Holland
Publication date: 
21 Oct 2017
Authors: 

Taufique Z Redhwan, Arif U Alam, Massimo Catalano, Luhua Wang, Moon J Kim, Yaser M Haddara, Matiar MR Howlader

Biblio References: 
Origin: 
Materials Letters