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Low-temperature thin film encapsulation for MEMS with silicon nitride/chromium cap

Type: 
Journal
Description: 
Publisher: 
IEEE
Publication date: 
30 Jun 2023
Authors: 

Anna Persano, Alvise Bagolini, Jacopo Iannacci, David Novel, Adriana Campa, Fabio Quaranta

Biblio References: 
Origin: 
IEEE Sensors Journal
Link: 
https://scholar.google.it/citations?view_op=view_citation&hl=en&citation_for_vie...

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